ENTITY · deca_technologies
Deca Technologies
United States·advanced packaging·challenger
Independent licensor of M-Series fan-out wafer-level packaging with Adaptive Patterning die-shift correction.
CLEAR · 0–39
6/100 illustrative
Underwriting Thesis
CLEAR — Deca Technologies shows no material chokepoint exposure in advanced packaging; low foreign, sole-source, sanctions, and downstream risk.
Factor Breakdown
Foreign-Origin Concentration3
Sole-Source Dependence19
Sanctions Exposure0
Downstream Criticality0
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 0
No mapped downstream customers.