ENTITY · maxscend
Maxscend Microelectronics300782
China·rf·challenger·$9.0B mkt cap
Chinese RF front-end chip designer.
WATCH · 40–69
49/100 illustrative
Underwriting Thesis
WATCH — Maxscend Microelectronics: concentrated foreign-origin supply compounded by criticality to DoD-exposed downstream programs in rf. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration100
Sole-Source Dependence29
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Shortest paths → DoD-exposed firms
- Scale AI · 3 hops · $105.6MMaxscend Microelectronics → Samsung Electronics → NVIDIA → Scale AI
- GlobalFoundries · 4 hops · $1.05BMaxscend Microelectronics → Samsung Electronics → Broadcom → Furukawa Electric → GlobalFoundries
- Marvell Technology · 4 hops · $184.3MMaxscend Microelectronics → Samsung Electronics → Broadcom → InnoLight Technology → Marvell Technology
- Valens Semiconductor · 5 hops · $28.3MMaxscend Microelectronics → Samsung Electronics → Broadcom → Furukawa Electric → TSMC → Valens Semiconductor
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 1
- Samsung ElectronicsSouth KoreaALLIED