CHOKEPOINT
MIXEDGraph 2026-08-10---- -- -- --:--:-- UTC
ENTITY · micron

Micron TechnologyMU

United States·dram·major

Only US-based DRAM/NAND maker; ramping HBM for AI accelerators.

WATCH · 40–69
45/100 illustrative
Underwriting Thesis

WATCH — Micron Technology: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in dram. A chokepoint underwriting concern at this tier.

Factor Breakdown
Foreign-Origin Concentration48
Sole-Source Dependence73
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure

Entity not present on tracked screening lists (CSL).

DoD Exposure

No matched DoD semiconductor awards (USASpending) for this entity.

Segments
dramnandhbm
Shortest paths → DoD-exposed firms
  • Scale AI · 2 hops · $105.6M
    Micron Technology → NVIDIA → Scale AI
  • GlobalFoundries · 3 hops · $1.05B
    Micron Technology → Broadcom → Furukawa Electric → GlobalFoundries
  • Marvell Technology · 3 hops · $184.3M
    Micron Technology → Broadcom → InnoLight Technology → Marvell Technology
  • Valens Semiconductor · 4 hops · $28.3M
    Micron Technology → Broadcom → Furukawa Electric → TSMC → Valens Semiconductor
Chokepoint Relationships

Key Suppliers · upstream · 22

Key Customers · downstream · 10

Data Provenance· generated 2026-08-10 01:06:49Z
  • Consolidated Screening List (CSL) [LIVE] https://data.trade.gov/downloadable_consolidated_screening_list/v1/consolidated.json @ 2026-08-10T01:06:49.039Z
  • USASpending.gov — DoD award search [LIVE] https://api.usaspending.gov/api/v2/search/spending_by_award/ @ 2026-08-10T01:06:49.377Z
  • Curated ownership aggregation [FALLBACK] @ 2026-08-10T01:06:49.378Z
  • Curated China-ecosystem + Nexperia edges (Phase B, CSET ETO + TechInsights + TrendForce + SCMP + BIS Entity List + Nexperia press release) [FALLBACK] @ 2026-08-10T01:06:49.378Z

Firm/commodity-level signals from public data — not component-level BOM. Scores are an analytic underwriting heuristic, not legal or procurement advice.