SUBSTITUTES
Alternative producers in overlapping segments/subsegments — ranked by lower chokepoint score. Sanctioned peers sink to the bottom.
ASMPT
Keys: equipment back end · equipment back end/assembly packaging equipment · equipment back end/bonders
| Candidate | Country | Score | Verdict | Overlap | |
|---|---|---|---|---|---|
| Nordson | United States | 31 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| SEMES | South Korea | 34 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| Tokyo Seimitsu (Accretech) | Japan | 35 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| SUSS MicroTec | Germany | 36 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| EV Group | Austria | 37 | CLEAR | equipment back end/bonders | Compare › |
| Hanmi Semiconductor | South Korea | 37 | CLEAR | equipment back end/bonders | Compare › |
| DISCO | Japan | 38 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| BE Semiconductor Industries | Netherlands | 38 | CLEAR | equipment back end/bonders | Compare › |
| Kulicke & Soffa | Singapore | 39 | CLEAR | equipment back end/bonders | Compare › |
| TOWA | Japan | 39 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| Aehr Test Systems | United States | 26 | CLEAR | equipment back end | Compare › |
| inTEST | United States | 26 | CLEAR | equipment back end | Compare › |