BLAST RADIUS
If this track is cut off, here's what loses a node across the defense-relevant supply chain.
Critical chokepoints
9
Directly Affected
195
Total Affected
4
DoD-Exposed Hit
32
Segments Hit
DoD-Exposed in Blast Radius · Cutting Chipbond Technology strands Scale AI, Marvell Technology, GlobalFoundries, Valens Semiconductor — firms with matched US defense procurement awards.
- Chipbond Technology → NVIDIA → Scale AI · 2h · $105.6M
- Chipbond Technology → Broadcom → Furukawa Electric → GlobalFoundries · 3h · $1.05B
- Chipbond Technology → Broadcom → InnoLight Technology → Marvell Technology · 3h · $184.3M
- Chipbond Technology → Broadcom → Furukawa Electric → TSMC → Valens Semiconductor · 4h · $28.3M
Blast Radius · tiered dependency cascade
Track Goes Dark
Chipbond Technology
195 tracks downstream
→
Tier 1 · direct9
Tier 2 · indirect72
Tier 3 · indirect10
Tier 4 · indirect91
Tier 5 · indirect13
DoD-exposedSole-sourceScore = firm criticality / 100
Segments Touched (32)
ai labanalog mixed signalcolocationcpucustom silicondata center reitdisplay icsdistributorsdramedge iot socfoundry servicesfpgagpu ai acceleratorshbmhyperscaleridmip licensingmobile socmodulesnandneocloudnetworking siliconnetworking systemsphotonics opticsphotoresists chemicalspowerpower thermalpure playrfspecialty memorysubstratessystems odm