ENTITY · chipbond
Chipbond Technology6147
Taiwan·assembly test·major·$5.9B mkt cap
Display-driver IC bumping, COG, and gold-bump packaging and test leader.
WATCH · 40–69
52/100 illustrative
Underwriting Thesis
WATCH — Chipbond Technology: concentrated foreign-origin supply compounded by sole-source / single-point-of-failure dominance in assembly test. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration75
Sole-Source Dependence71
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Shortest paths → DoD-exposed firms
- Scale AI · 2 hops · $105.6MChipbond Technology → NVIDIA → Scale AI
- GlobalFoundries · 3 hops · $1.05BChipbond Technology → Broadcom → Furukawa Electric → GlobalFoundries
- Marvell Technology · 3 hops · $184.3MChipbond Technology → Broadcom → InnoLight Technology → Marvell Technology
- Valens Semiconductor · 4 hops · $28.3MChipbond Technology → Broadcom → Furukawa Electric → TSMC → Valens Semiconductor
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 9
- Novatek MicroelectronicsTaiwanCHOKEPOINT
- Himax TechnologiesTaiwanCHOKEPOINT
- FitipowerTaiwanCHOKEPOINT
- NVIDIAUnited StatesDOMESTIC
- AMDUnited StatesDOMESTIC
- QualcommUnited StatesDOMESTIC
- BroadcomUnited StatesDOMESTIC
- AppleUnited StatesDOMESTIC
- MediaTekTaiwanCHOKEPOINT