ENTITY · tanaka
Tanaka Precious Metals
Japan·packaging materials·major
Precious-metals group supplying bonding wire, plating, and targets.
CLEAR · 0–39
36/100 illustrative
Underwriting Thesis
CLEAR — Tanaka Precious Metals: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in packaging materials. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence74
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
packaging materialssputtering targets
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BTanaka Precious Metals → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MTanaka Precious Metals → ASE Technology → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MTanaka Precious Metals → ASE Technology → Valens Semiconductor
- Scale AI · 3 hops · $105.6MTanaka Precious Metals → ASE Technology → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 13
- ASE TechnologyTaiwanCHOKEPOINT
- Amkor TechnologyUnited StatesDOMESTIC
- JCET GroupChinaHostileADVERSARY
- CHOKEPOINT
- ADVERSARY
- Huatian TechnologyChinaHostileADVERSARY
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC