ENTITY · mitsubishi_materials
Mitsubishi Materials5711
Japan·sputtering targets·major·$3.9B mkt cap
Advanced materials; sputtering targets, bonding wire, and cemented carbide.
CLEAR · 0–39
34/100 illustrative
Underwriting Thesis
CLEAR — Mitsubishi Materials: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in sputtering targets. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence67
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BMitsubishi Materials → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MMitsubishi Materials → TSMC → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MMitsubishi Materials → TSMC → Valens Semiconductor
- Scale AI · 3 hops · $105.6MMitsubishi Materials → TSMC → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 7
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC